SemiAI to Present Agentic AI Semiconductor Manufacturing Technology at SEMICON Taiwan 2026

[Tech World = Reporter Lee Gwang-jae] SemiAI, an AI company specializing in semiconductor manufacturing, will participate in SEMICON Taiwan 2026, held in Taipei from September 2–4, 2026. CEO Ji Tae-kwon will also present at the Silicon Startup Stage.

The company will introduce its SMILE platform, which uses AI to analyze semiconductor manufacturing data, predict potential yield problems, identify root causes, and recommend corrective actions. SemiAI aims to connect these capabilities into a unified workflow that helps engineers optimize processes and make faster, data-driven decisions.

The presentation, titled “Agentic AI for Predictive Yield and Autonomous Fab Analytics,” will focus on how agentic AI can address major fab challenges including yield prediction, root-cause analysis, and process optimization.

A key technology featured will be SemiAI's Multi-Peer Agent Architecture, where multiple specialized AI agents analyze different types of semiconductor data—including process, equipment, measurement, and defect data—and work together like an engineering team.

Through SEMICON Taiwan 2026, SemiAI plans to showcase its vision for AI-driven and increasingly autonomous semiconductor manufacturing, while expanding collaboration with global semiconductor manufacturers, equipment companies, and technology partners.

Source: Tech World ( https://www.epnc.co.kr )